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  • Source: Microelectronic Engineering. Unidade: IFSC

    Subjects: SENSORES BIOMÉDICOS, CORONAVIRUS, COVID-19

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    • ABNT

      NASCIMENTO, Isabella Sampaio do et al. Capacitive immunosensor for COVID-19 diagnosis. Microelectronic Engineering, v. 267-268, n. Ja 2023, p. 111912-1-111912-8, 2023Tradução . . Disponível em: https://doi.org/10.1016/j.mee.2022.111912. Acesso em: 28 abr. 2024.
    • APA

      Nascimento, I. S. do, Takeuti, N. N. K., Gusson, B., Machado, T. R., & Zucolotto, V. (2023). Capacitive immunosensor for COVID-19 diagnosis. Microelectronic Engineering, 267-268( Ja 2023), 111912-1-111912-8. doi:10.1016/j.mee.2022.111912
    • NLM

      Nascimento IS do, Takeuti NNK, Gusson B, Machado TR, Zucolotto V. Capacitive immunosensor for COVID-19 diagnosis [Internet]. Microelectronic Engineering. 2023 ; 267-268( Ja 2023): 111912-1-111912-8.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/j.mee.2022.111912
    • Vancouver

      Nascimento IS do, Takeuti NNK, Gusson B, Machado TR, Zucolotto V. Capacitive immunosensor for COVID-19 diagnosis [Internet]. Microelectronic Engineering. 2023 ; 267-268( Ja 2023): 111912-1-111912-8.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/j.mee.2022.111912
  • Source: Microelectronic Engineering. Unidade: IF

    Subjects: PROPRIEDADES DOS MATERIAIS, NANOTECNOLOGIA

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      RAHIM, Abdur et al. Energy relaxation of hot carriers near the charge neutrality point in HgTe-based 2D topological insulators. Microelectronic Engineering, v. 206, p. 55-59, 2019Tradução . . Disponível em: https://doi.org/10.1016/j.mee.2018.12.011. Acesso em: 28 abr. 2024.
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      Rahim, A., Gusev, G. M., Kvonc, Z. D., Olshanetsky, E. B., Mikhailov, N. N., & Dvoretsky, S. A. (2019). Energy relaxation of hot carriers near the charge neutrality point in HgTe-based 2D topological insulators. Microelectronic Engineering, 206, 55-59. doi:10.1016/j.mee.2018.12.011
    • NLM

      Rahim A, Gusev GM, Kvonc ZD, Olshanetsky EB, Mikhailov NN, Dvoretsky SA. Energy relaxation of hot carriers near the charge neutrality point in HgTe-based 2D topological insulators [Internet]. Microelectronic Engineering. 2019 ; 206 55-59.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/j.mee.2018.12.011
    • Vancouver

      Rahim A, Gusev GM, Kvonc ZD, Olshanetsky EB, Mikhailov NN, Dvoretsky SA. Energy relaxation of hot carriers near the charge neutrality point in HgTe-based 2D topological insulators [Internet]. Microelectronic Engineering. 2019 ; 206 55-59.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/j.mee.2018.12.011
  • Source: Microelectronic Engineering. Unidade: EP

    Assunto: MICROELETRÔNICA

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    • ABNT

      DORIA, Rodrigo Trevisoli et al. In-depth low frequency noise evaluation of substrate rotation and strain engineering in n-type triple gate SOI FinFETs. Microelectronic Engineering, v. 147, n. 1, p. 92-95, 2015Tradução . . Disponível em: https://doi.org/10.1016/j.mee.2015.04.056. Acesso em: 28 abr. 2024.
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      Doria, R. T., Claeys, C., Simoen, E., Souza, M. A. S. de, & Martino, J. A. (2015). In-depth low frequency noise evaluation of substrate rotation and strain engineering in n-type triple gate SOI FinFETs. Microelectronic Engineering, 147( 1), 92-95. doi:10.1016/j.mee.2015.04.056
    • NLM

      Doria RT, Claeys C, Simoen E, Souza MAS de, Martino JA. In-depth low frequency noise evaluation of substrate rotation and strain engineering in n-type triple gate SOI FinFETs [Internet]. Microelectronic Engineering. 2015 ; 147( 1): 92-95.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/j.mee.2015.04.056
    • Vancouver

      Doria RT, Claeys C, Simoen E, Souza MAS de, Martino JA. In-depth low frequency noise evaluation of substrate rotation and strain engineering in n-type triple gate SOI FinFETs [Internet]. Microelectronic Engineering. 2015 ; 147( 1): 92-95.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/j.mee.2015.04.056
  • Source: Microelectronic Engineering. Conference titles: International Conference on Low Dimensional Structures and Devices. Unidades: IF, IME

    Subjects: MATÉRIA CONDENSADA, ENGENHARIA AUTOMOBILÍSTICA

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    • ABNT

      ROSA, A L et al. Hole band structure of p-type delta-doping quantum wells in silicon. Microelectronic Engineering. Amsterdam: Elsevier Science. . Acesso em: 28 abr. 2024. , 1998
    • APA

      Rosa, A. L., Scolfaro, L. M. R., Sipahi, G. M., Enderlein, R., & Leite, J. R. (1998). Hole band structure of p-type delta-doping quantum wells in silicon. Microelectronic Engineering. Amsterdam: Elsevier Science.
    • NLM

      Rosa AL, Scolfaro LMR, Sipahi GM, Enderlein R, Leite JR. Hole band structure of p-type delta-doping quantum wells in silicon. Microelectronic Engineering. 1998 ; 43-44 489-496.[citado 2024 abr. 28 ]
    • Vancouver

      Rosa AL, Scolfaro LMR, Sipahi GM, Enderlein R, Leite JR. Hole band structure of p-type delta-doping quantum wells in silicon. Microelectronic Engineering. 1998 ; 43-44 489-496.[citado 2024 abr. 28 ]
  • Source: Microelectronic Engineering. Conference titles: International Conference on Low Dimensional Structures and Devices. Unidade: IF

    Assunto: ENGENHARIA AUTOMOBILÍSTICA

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      QUIVY, A. A. e LEITE, J. R. Spatial confinement of self-organized MBE-growth 'In IND.x''Ga IND.1-X' As quantum dots. Microelectronic Engineering. Amsterdam: Elsevier Science. . Acesso em: 28 abr. 2024. , 1998
    • APA

      Quivy, A. A., & Leite, J. R. (1998). Spatial confinement of self-organized MBE-growth 'In IND.x''Ga IND.1-X' As quantum dots. Microelectronic Engineering. Amsterdam: Elsevier Science.
    • NLM

      Quivy AA, Leite JR. Spatial confinement of self-organized MBE-growth 'In IND.x''Ga IND.1-X' As quantum dots. Microelectronic Engineering. 1998 ; 43-44 19-23.[citado 2024 abr. 28 ]
    • Vancouver

      Quivy AA, Leite JR. Spatial confinement of self-organized MBE-growth 'In IND.x''Ga IND.1-X' As quantum dots. Microelectronic Engineering. 1998 ; 43-44 19-23.[citado 2024 abr. 28 ]
  • Source: Microelectronic Engineering. Unidade: EP

    Assunto: MICROELETRÔNICA

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    • ABNT

      PAVANELLO, Marcelo Antonio e MARTINO, João Antonio e COLINGE, Jean-Pierre. Analytical modeling of the substrate effect on accumulation-mode SOI pMOSFETs at room temperature and at 77k. Microelectronic Engineering, v. 36, n. 1-4, p. 375-378, 1997Tradução . . Disponível em: https://doi.org/10.1016/s0167-9317(97)00083-x. Acesso em: 28 abr. 2024.
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      Pavanello, M. A., Martino, J. A., & Colinge, J. -P. (1997). Analytical modeling of the substrate effect on accumulation-mode SOI pMOSFETs at room temperature and at 77k. Microelectronic Engineering, 36( 1-4), 375-378. doi:10.1016/s0167-9317(97)00083-x
    • NLM

      Pavanello MA, Martino JA, Colinge J-P. Analytical modeling of the substrate effect on accumulation-mode SOI pMOSFETs at room temperature and at 77k [Internet]. Microelectronic Engineering. 1997 ; 36( 1-4): 375-378.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/s0167-9317(97)00083-x
    • Vancouver

      Pavanello MA, Martino JA, Colinge J-P. Analytical modeling of the substrate effect on accumulation-mode SOI pMOSFETs at room temperature and at 77k [Internet]. Microelectronic Engineering. 1997 ; 36( 1-4): 375-378.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/s0167-9317(97)00083-x
  • Source: Microelectronic Engineering. Unidade: EP

    Assunto: CIRCUITOS INTEGRADOS

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    • ABNT

      VERDONCK, Patrick Bernard e BRASSEUR, G. e SWART, J. Reactive ion etching and plasma etching of tungsten. Microelectronic Engineering, v. 21, p. 329-332, 1993Tradução . . Disponível em: https://doi.org/10.1016/0167-9317(93)90084-i. Acesso em: 28 abr. 2024.
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      Verdonck, P. B., Brasseur, G., & Swart, J. (1993). Reactive ion etching and plasma etching of tungsten. Microelectronic Engineering, 21, 329-332. doi:10.1016/0167-9317(93)90084-i
    • NLM

      Verdonck PB, Brasseur G, Swart J. Reactive ion etching and plasma etching of tungsten [Internet]. Microelectronic Engineering. 1993 ; 21 329-332.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/0167-9317(93)90084-i
    • Vancouver

      Verdonck PB, Brasseur G, Swart J. Reactive ion etching and plasma etching of tungsten [Internet]. Microelectronic Engineering. 1993 ; 21 329-332.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/0167-9317(93)90084-i
  • Source: Microelectronic Engineering. Unidade: EP

    Assunto: CIRCUITOS INTEGRADOS

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      VERDONCK, Patrick Bernard e BRASSEUR, G. e COOPMANS, F. Laser enhanced polymer etching in different ambients. Microelectronic Engineering, v. 9, p. 507-510, 1989Tradução . . Disponível em: https://doi.org/10.1016/0167-9317(89)90111-1. Acesso em: 28 abr. 2024.
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      Verdonck, P. B., Brasseur, G., & Coopmans, F. (1989). Laser enhanced polymer etching in different ambients. Microelectronic Engineering, 9, 507-510. doi:10.1016/0167-9317(89)90111-1
    • NLM

      Verdonck PB, Brasseur G, Coopmans F. Laser enhanced polymer etching in different ambients [Internet]. Microelectronic Engineering. 1989 ; 9 507-510.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/0167-9317(89)90111-1
    • Vancouver

      Verdonck PB, Brasseur G, Coopmans F. Laser enhanced polymer etching in different ambients [Internet]. Microelectronic Engineering. 1989 ; 9 507-510.[citado 2024 abr. 28 ] Available from: https://doi.org/10.1016/0167-9317(89)90111-1

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